Introducing the JTR Series Lead-Free Hot Air Reflow Oven, equipped with advanced features for enhanced efficiency and performance. The oven includes a reinforced main hanging bracket to prevent rail deformation and board jamming. Its multi-layer thermal insulation design reduces the oven body surface temperature by 10 to 20 degrees, effectively lowering the working environment temperature. A new cooling configuration redirects filtered or reclaimed air back into the oven chamber, reducing thermal loss and improving flux collection. Furthermore, the oven boasts a 15% improvement in heat transferring efficiency, specifically designed to handle lead-free processes and larger, more complex products. Its dual-rails conveyor system increases production efficiency, saves power, and reduces costs. With a sealed oven design, nitrogen loss is prevented, achieving oxygen concentrations as low as 150ppm. Optional nitrogen construction features a high-precision, reliable Oxygen analyzer and cooling water system, ensuring reduced solder, prevention of bridging, and high-quality welding.

The KT series high-end lead-free hot air reflow oven is designed for high-speed production and high-density PCBA technology. With a high capacity and a normal working conveyor speed of 160 cm/min, this oven ensures low energy consumption and cost efficiency. Its powerful temperature control maintains a setting and actual temperature difference within 1.0°C, and the load and unload temperature fluctuates within 1.5°C. Rapid temperature raising capability allows for a 100°C difference between neighboring zones. This oven employs the latest insulation techniques and chamber design, ensuring the surface temperature is only 5°C above room temperature. Nitrogen volume is controllable throughout the process, while oxygen density is independently controlled in a closed-loop system at 50-200 ppm in every zone. Advanced cooling technology, with optional double-sided multi-cooling zones and an effective cooling length of 1400 mm, ensures fast cooling of the product to the lowest output temperature. The KT series also features a new two-level flux separation system with multi-point collection, thoroughly separating flux and significantly reducing maintenance time and frequency. Its dual-line system operates at different speeds, offering double the capacity at one set cost and saving 65% on energy consumption.

Introducing the TEA Series Lead-Free Hot Air Reflow Oven, which brings a host of features designed for durability and efficiency. The rail conveyor system has undergone a hardening process, enhancing its reliability. The dual-rail conveyor system significantly improves productivity while saving energy and production costs. It also features a strengthened main hanging bracket to prevent rail deformation. Additionally, 95% of the materials used in the reflow oven can be recycled, highlighting its environmentally friendly design. The patented optimized structure design minimizes the impact of the chamber on the surrounding environmental temperature. Moreover, the automatic flux collection system simplifies maintenance, ensuring the oven remains efficient and easy to manage.

The Centurion REFLOW OVEN is a forced-convection SMT reflow system designed for high-throughput PCB assembly environments, offering tight, closed-loop process control. Known for its exceptional heat transfer, the Centurion can run any profile at the lowest set point possible, minimizing thermal variations and energy consumption. Featuring an efficient heat transfer design, the Centurion maintains a low energy consumption rate. Its robust and reliable construction, supported by over 20 years of SMT experience, ensures high uptime even under the most demanding reflow conditions. The patented CATHOX™ (Catalytic Thermal Oxidizer) reduces maintenance needs through advanced flux treatment technology, further lowering the cost of ownership. Additionally, the new 'idle mode' option decreases operational costs. With its latest design, the Centurion achieves superior thermal transfer even with a wider process chamber, drawing on the knowledge and experience gained from previous generations. This expertise in process control ensures repeatability across the oven, meeting the stringent requirements of the most demanding customers and challenging processes globally.

The Vitronics Soltec XPM3 1030 product platform represents the latest evolution in a long history of reflow systems renowned for their superior reliability and worldwide capability. Its robust design, combined with a unique heat transfer system, consistently delivers benchmark thermal performance, precise process control, and exceptional value for high production in a 24/7 environment. Key standard features include the AUTOset profile/recipe generator, a maximum setpoint temperature of 350°C, and a lifetime warranty on heaters and blowers. The Flux Flow Control flux evacuation system and patented Individual Cell inlet and exhaust system ensure optimized gas flow management. Additionally, active forced convection top and bottom cooling cells and easy-to-maintain cooling zones further enhance the platform's performance. Optional features include advanced controlled cooling, a nitrogen atmosphere with true air switching and quick purge, CAMX host communication software, a stack filter, dual lane with independent lane speed control, a condensing gas recirculation system, and a bar code traceability system.

The DEK Horizon 03ix automatic solder paste printer is engineered to deliver precise printing accuracy of six sigma + 25 microns. Its high precision servo motor drive, coupled with PC control, ensures printing stability and accuracy, alongside repeatable image pattern recognition for precise positioning. Featuring a cantilever type printing head with a robust design, the printer maintains uniform and stable printing quality through computer servo control of scraper pressure, speed, and stroke. The scraper beam, optimized for lightness and aesthetics, further enhances performance. This automatic solder paste printing machine offers versatile cleaning options, including dry, wet, or vacuum cleaning, with programmable control and adjustable cleaning intervals. It thoroughly removes residual solder paste from the mesh, guaranteeing high-quality printing. The multifunctional plate handling device accommodates PCBs of various sizes and thicknesses, securely positioning and clamping them with removable magnetic thimbles and side clamp devices. This setup effectively mitigates plate deformation, ensuring consistent printing results. With its InstinctivTMV9 operation interface and comprehensive software functions, the DEK03iX automatic solder paste printer fosters an intuitive user experience, characterized by simple operation and ease of learning. Additionally, it features self-diagnostic capabilities with audible and visual alarms to identify and address faults promptly, enabling seamless operation for single or double PCBs alike.