Meet the YAMAHA YSM10, the High-Speed Compact Modular Mounter that combines the best capabilities of three machines into one innovative platform. Designed to handle a wide range of components, from ultra-micro-chips measuring 0201 (0.2 mm × 0.1 mm) to large parts sized 55 mm × 100 mm and 15 mm in height, the YSM10 eliminates the need for head replacement by utilizing high-speed general-purpose heads, similar to those found in high-end models. With its unmatched mounting speed, the YSM10 leads the pack in its class. By leveraging a new-generation servo system from upper-ranked models and incorporating a lightweight and compact universal type head, mounting speed has been accelerated by over 25% compared to conventional models, achieving an industry-leading mounting speed of 46,000 CPH (chips per hour). Additionally, the YSM10 features an automatic recognition optimizer function, which prevents pickup and recognition errors. This function includes smart recognition, facilitating easy data generation for parts with complex shapes, and a recognition data auto-generator & tracking function (e-Vision), ensuring precise and error-free component recognition. Experience unparalleled speed, accuracy, and reliability with the YAMAHA YSM10, setting a new standard in surface mount technology.

Introducing the Yamaha Z:LEX YSM20R, an all-purpose surface mounter that takes the evolution of the "1-head solution" to new heights! With a staggering mounting speed of 90,000 CPH, this compact yet powerful machine is revolutionizing operations for operators worldwide. The YSM20R offers unprecedented flexibility, catering to a wide range of applications with ease. Its innovative "1-head solution" design accommodates a diverse range of component sizes, from super small chips to large components, all with a single type of head. This versatility enables superior production changeover ability, allowing seamless transitions between different product runs. Yamaha's focus on enhancing XY-axis speeds and optimizing pick-up to placement actions has resulted in a remarkable 5% improvement in mounting speed compared to its predecessor, the YSM20. Moreover, by enhancing the performance of the wide-scan camera on the head, the YSM20R can now mount components up to 12×12 mm in size at high speed, significantly boosting productivity. Additionally, the YSM20R features a new auto loading feeder designed to reduce costs and enhance user efficiency, further solidifying its position as the surface mounter of choice for businesses seeking unparalleled speed, adaptability, and productivity.

Introducing the YAMAHA Z:LEX YSM20WR Surface Mounter, taking the "1-head solution" to new heights with two types of heads that cater to a wide range of components while maintaining high speed without the need for head replacement. The YSM20WR offers unparalleled versatility with its high-speed general-purpose heads, perfect for handling ultra-small (0201mm) chip components. Additionally, its super wide-ranging type head provides exceptional load control and accommodates a broad spectrum of components, from ultra-tiny chips of 03015mm to ultra-large components measuring 55 x 100 mm and tall components up to 28 mm in height. Equipped with a new type wide-scan camera, the YSM20WR expands recognition capability to support high-speed mounting of components as small as 8 mm to 12 mm in size. Furthermore, the use of side lighting enables high-speed recognition of ball electrode components such as CSP (chip scale packages) and BGA (ball grid arrays). With its advanced features and capabilities, the YAMAHA Z:LEX YSM20WR sets a new standard in surface mount technology, empowering manufacturers to achieve unparalleled speed, accuracy, and reliability in their assembly processes.

The Ultra-High-Speed Modular Z:TA-R YSM40R sets a new standard in productivity, boasting a revolutionary speed of 200,000 CPH, making it the fastest in the world on a compact platform. This remarkable speed is achieved through cutting-edge technology, including innovative high-speed rotary heads and servo motors with advanced algorithms. Equipped with an innovative multi-camera system, the YSM40R ensures faster recognition speed and high accuracy. This system can also incorporate functions such as coplanarity check and side-view camera, further enhancing its capabilities. Additionally, the machine employs simultaneous component pickup technology and newly developed rotary control technology, along with lighter heads compared to previous high-speed models, to deliver revolutionary productivity. Despite its 4-beam unit configuration, the YSM40R boasts a remarkably small footprint, with a width of only 1 meter and a depth of 2.1 meters. This compact design maximizes productivity per line length and surface area, making it an invaluable asset for optimizing factory space utilization. Furthermore, the YSM40R features a dual lane system, offering superb versatility by feeding two parallel lanes of PCBs ranging from small to mid-sized, up to large-sized PCBs measuring 700mm in length. With its unparalleled speed, versatility, and compact design, the Ultra-High-Speed Modular Z:TA-R YSM40R redefines productivity standards, empowering manufacturers to achieve maximum efficiency and performance even within limited factory space.

The BTU Aurora 150N reflow oven boasts a range of cutting-edge features and advantages tailored to optimize soldering processes. These include modern conveyor options, a fully updated user interface, integrated AquaScrub flux management technology, innovative Smart Power energy savings software, and advanced process control technologies. Moreover, the exclusive closed-loop convection control technology and flexible zone configuration ensure optimal heating or cooling requirements for various production needs. The new Aurora reflow oven platform introduces industry-leading advancements, such as the first factory configurable heating and cooling architecture. This innovation allows users to customize the reflow oven according to specific product or process characteristics, whether it involves handling very heavy boards, accommodating slow cooling requirements, or enhancing throughput. AURORA’S ADVANCED CONVEYOR OPTIONS further enhance the functionality and efficiency of the BTU Aurora reflow oven. With up to 5 moveable rails, dual lane and speed capabilities, and a dual center support engagement system, this oven offers versatility and precision. Moreover, the chain return path within the rail minimizes power consumption, while the single platform design improves configurability and reduces the need for common parts. The wider board capabilities, including a 620 mm (24.4″) single lane and 305 mm (12″) per lane for dual lane configurations, coupled with a total product clearance of 80 mm, ensure seamless compatibility with diverse production requirements.

Introducing the BTU Pyramax 75A, a compact yet powerful soldering convection reflow oven designed to meet the demands of modern electronics manufacturing. With its 6 heated zones, this oven offers precise temperature control and uniform heating for efficient reflow soldering processes. BTU reflow ovens are renowned for their reliability and performance, making them a trusted choice for manufacturers worldwide. The Pyramax 75A is no exception, providing consistent results and peace of mind with every use. Despite its compact size, the Pyramax 75A is a high-end BTU air reflow solder oven, offering advanced features and capabilities to meet the needs of today's electronics industry. Whether you're soldering small batches or high-volume production runs, this oven delivers exceptional performance and quality.