The Koh Young KY8030-2 has maintained its position as the industry's leading and best-selling True 3D Solder Paste Inspection System since its market debut. Utilizing Koh Young’s patented 3D dual-projection Moiré technology, it effectively addresses critical shadow and specular reflection challenges that other 3D inspection systems cannot resolve. Koh Young’s unique warp compensation technology, Z-tracking 3D Compensation, actively calculates and detects any substrate warpage. Leveraging exclusive 3D imaging and algorithms, it accounts for multiple elements like slope, stretch, twist, bow, and shrinkage to ensure accurate measurements, meeting the highest inspection system criteria. The KY8030-2 can be equipped with an optional automatic solder paste dispensing system. This high-precision, user-friendly dispensing system helps eliminate costly mistakes caused by insufficient solder in open joints, lean fillets, and weak joints. The automatic dispensing option reduces operational costs, improves line efficiency, and enhances profitability by minimizing board scrap and rework. When configured with the Auto-Rework option, Koh Young’s SPI system becomes more than an inspection tool; it becomes a true process optimizer.

Koh Young KY8030-3 returns with enhanced speed, leveraging Koh Young’s 3D dual-inspection technology to address critical shadow issues while boosting productivity and accelerating production. The KY8030-3 combines Koh Young’s innovative technologies with a remarkable inspection speed of 91.2 cm²/sec. This blend of high throughput and accuracy makes it ideal for a wide range of applications. The latest enhancements double the speed of its predecessor while ensuring precise measurements. Koh Young’s advanced warp compensation technology, Z-tracking 3D Compensation, actively detects and calculates substrate warpage. By using proprietary 3D imaging and algorithms, it considers factors like slope, stretch, twist, bow, and shrinkage to provide accurate measurements and meet top-tier inspection standards. Moreover, the system offers a real-time, automatic Pad-referencing 2D compensation option that utilizes IR lighting to tackle non-linear inspection challenges. It does so by comparing PCB pad locations with the ideal stencil design from the CAD file, ensuring precise and dependable inspection outcomes.

Delivering an optimal balance of cost and performance, the Koh Young KY8080 offers exceptional value for diverse application needs that demand enhanced product quality, increased productivity, and improved operational efficiency. The KY8080 integrates Koh Young’s proprietary True 3D measurement and inspection technologies to reliably identify process defects. Combining Koh Young’s expertise in optomechatronics with its unique vision algorithms and pioneering inspection technologies, the KY8080 minimizes the total cost of ownership while maximizing performance and cost-effectiveness. Koh Young provides a state-of-the-art SPC toolkit, widely used throughout the industry. The comprehensive SPC Plus allows users to easily understand their production processes with features such as histograms, X-bar & R-Chart, X-bar & S-chart, Cp & Cpk, and % of Gage R&R. Data can be viewed in real-time and in multiple display formats, with the software capable of generating automatic reports from a remote computer. The KY8080 enables customers to enhance production quality while reducing operating costs, thereby increasing manufacturing visibility.

The Magic-ray 3D SPI-Icon series is designed for 3D solder paste inspection following SMT screen printing, offering a range of advanced features to enhance inspection accuracy and efficiency. The series utilizes intelligent zero reference point technology to ensure precise measurements, even in the presence of PCB board deformation. By combining 3D and color-featured algorithms, it effectively detects solder bridging, solder breakage, icicles, and other defects, ensuring high performance. With flexible choices of multiple optical options, the system provides industry-leading inspection speed and performance. Additionally, the Magic-ray 3D SPI-Icon series features strong anti-jamming capabilities, making it effective in detecting PCBs with different color variations. It automatically adjusts inspection specifications for black and white boards to maintain consistent accuracy. Programming is fast and can be done with or without a Gerber file, streamlining the setup process. SPC data analysis further enhances process optimization, helping to improve process quality and ensure optimal production efficiency while reducing defects. Overall, the Magic-ray 3D SPI-Icon series is an ideal solution for enhancing solder paste inspection and overall SMT process quality.

The MagicRay 3D SPI-VSP3000 series is ideal for 3D solder paste inspection following SMT screen printing. It offers fast programming without the need for a Gerber file, making setup quick and straightforward. The series features intelligent zero reference point technology to ensure accurate height measurements, effectively detecting issues such as solder bridging, solder breakage, and icicles. The MagicRay 3D SPI-VSP3000 series is also adept at handling PCBs with different color variations. Its bare board zero-point compensation enhances the accuracy of both solder paste height and volume measurements. The system includes SPC data analysis to help improve process quality, and its Three Point Checks software enables rapid detection of the root causes of excess solder paste, insufficient solder paste, and smearing. Overall, the MagicRay 3D SPI-VSP3000 series provides comprehensive inspection capabilities to ensure high-quality SMT production processes.

Saki’s high-speed, high-precision 3D-SPI machines are designed to excel in the inspection of SMT process solder printing. These machines meticulously inspect and analyze a wide range of potential issues, measuring solder paste area, height, and volume, as well as checking for bridging, solder horns, and BGA coplanarity compliance. The quality of the entire production line is maintained through machine-to-machine coordination with solder printing and pick-and-place machines. The design features an ultra-rigid gantry and biaxial drive with an ultra-high-definition linear scale, enabling high-speed movement of the optical head with remarkable stopping position accuracy. Thanks to its ultra-rigid gantry, biaxial drive, and ultra-high-definition linear scale, the 3D-SPI ensures high repeatability and contributes to the stability and quality of inspection result data. Stable inspection is further guaranteed by a strong, durable frame that provides reliability for 15 years and beyond, ensuring long-term consistency and performance.