The TR7700 SIII Plus represents the latest advancement in TRI's AOI technology, offering precise multi-phase inspection at high speeds. Equipped with an ultra-fast camera, intelligent auto conveyor, and a redesigned user interface, this system provides a robust and user-friendly AOI solution. It facilitates quick programming, efficient board loading, smooth production line integration, and supports offline programming. The system's new color algorithm, along with multiple lighting phases, enhances defect detection and ensures high inspection accuracy with minimal false positives. Key features include high-speed, high-precision multi-phase AOI, an intuitive GUI for easy programming and offline editing, an intelligent auto conveyor that reduces load times, and an advanced color algorithm for improved accuracy and reduced false calls.
The TR7700Q 3D AOI combines the latest 2D and 3D technologies, utilizing digital quad fringe pattern projection to revolutionize PCB assembly inspection. Its versatile programmable 3D digital fringe pattern technology covers a wide inspection range with exceptional accuracy, detecting even the smallest coplanarity defects and solder joint issues. Ensuring the quality of solder joints is achieved through IPC-compliant 3D solder fillet inspection, which checks the fillet shape to detect issues like insufficient solder volume, non-wetting, and dry pads. This system features ultra-high precision 2D+3D stop-and-go AOI, solder height and volume inspection, and accurate quad 3D digital fringe projection. It also boasts an adaptive 3D height range of up to 30 mm and an air-free intelligent conveyor system (IACS), making it a robust solution for comprehensive PCB assembly inspection.
The TR7700QH SII Series represents the latest advancement in ultra-high-speed 3D Automated Optical Inspection (AOI), capable of inspecting at impressive speeds of up to 80 cm² per second while maintaining uncompromised Gauge Repeatability and Reproducibility (R&R). This ensures precise and consistent inspection results, critical for maintaining high-quality standards in manufacturing processes. The TR7700QH SII is powered by TRI's state-of-the-art Smart Programming, cutting-edge AI Algorithms, and advanced Metrology measurement capabilities, all working together to deliver exceptional accuracy and efficiency. These technologies allow for rapid adaptation to various inspection needs, providing a flexible and robust solution for complex production environments. Furthermore, the TR7700QH SII is fully compatible with the latest Smart Factory standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852). This compatibility ensures seamless integration with modern manufacturing ecosystems, facilitating enhanced connectivity, data exchange, and process automation. By supporting these standards, the TR7700QH SII not only meets current industry requirements but also helps pave the way for future advancements in intelligent manufacturing and quality control.
The MagicRay 3D AXI-VX2000 machine offers high-speed imaging and multi-angle projection reconstruction, making it ideal for inline non-destructive inspection of SMT, DIP, and IGBT semiconductors. It covers a wide range of components, including BGA/LGA/CSP, SOP/QFP/QFN, transistors, R/C-IGBT, bottom electrodes, power modules, POP, connectors, THT components, and more. Featuring high-speed dynamic imaging, the detection speed of the AXI-VX2000 reaches 1.7 seconds per field of view (FOV). It adaptively applies seven projection styles and seven resolution types to meet various usage scenarios. The machine supports three separate programming styles and offers one-touch value learning functionality, simplifying the setup process. Its XY, YZ, and XZ three-view interface makes diagnosing defects more intuitive. Additionally, dual linear motors with grating rulers ensure precise positioning, enhancing the accuracy and reliability of inspections. Overall, the MagicRay 3D AXI-VX2000 machine combines advanced imaging technology with versatile projection and programming options, making it a powerful solution for comprehensive semiconductor inspection.
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