High Performance 3D AXI for Large PCB Assemblies The TRI TR7600 SIII series is TRI’s flagship inline line scan 3D AXI system, specifically tailored for the inspection of larger board sizes, up to 1200 mm x 660 mm. Designed for high performance 3D AXI for large PCB assemblies, this series offers the fastest high-resolution imaging performance and superior image quality in the industry’s most advanced automatic X-ray inspection. Equipped with new 3D AXI intuitive software, the TR7600 SIII series simplifies the setup of inspection programs based on CAD data. The system includes TRI’s extensive smart component library, reducing the engineer's workload and minimizing production downtime. Enhanced 3D inspection with planar CT imaging can recreate a complete 3D model of each solder joint, enabling clear analysis of shape irregularities, head-in-pillow defects, and voiding problems. Vertical cross-section CT images assist with reliable visual reviews of borderline and buried solder joints. Delivering ultra-high-speed 3D CT X-ray inspection with excellent image quality, the TR7600 SIII series features a true 3D solder joint viewer that provides high resolution for inspecting even the smallest components, such as 01005 inch chips. This ensures thorough and accurate inspection of large PCB assemblies, making it a leading solution in the industry.
The TRI TR7600F2D is engineered for high-performance inline 2.5D AXI, particularly suited for single-layer PCB and FPCB assemblies requiring exceptional image clarity. This system is ideal for mobile electronics, as it can effectively identify minute voids, 01005 solder defects, and various QFN and BGA issues. By integrating fully automated programming with multi-resolution capabilities, it optimizes production yields efficiently. Designed for ultra-high-resolution inspection, the TR7600F2D covers areas up to 900 mm x 460 mm and significantly reduces engineer workload through automated setup processes. Its advanced processing and multi-resolution options guarantee superior image quality. The system also employs 2D and off-axis imaging to provide shadow-free inspection, with an X-ray tube adjustable up to 130 kV/300 µA. These features collectively make the TR7600F2D a premier solution for ensuring the highest standards in mobile electronics production.
Next Generation Platform Design for Higher Speed up to 10 FOV/s The TRI TR7600F3D SII is the next-generation high-speed in-line automated X-ray inspection (AXI) solution, offering speeds up to two to three times faster than the previous model. This advanced AXI system can inspect large boards up to 900 mm x 460 mm, significantly lowering escapes and false calls without compromising the production line's cycle time. With 5 µm high precision, the TR7600F3D SII ensures comprehensive defect detection. Its next-generation mechanical design enables higher speeds, achieving up to 10 fields of view (FOV) per second. The system supports inline fine-tuning for multiple samples without interrupting production, enhancing efficiency and flexibility. Additionally, it is smart factory ready, offering easy MES connectivity to integrate seamlessly into modern production environments. This makes the TR7600F3D SII a leading solution for high-speed, accurate, and reliable inspection in demanding production settings.
The ASM SIPLACE SX chip mounter stands at the forefront of high-mix electronics production, offering unparalleled flexibility and versatility. With three enhanced placement heads – CP20, CPP, and TWIN – it covers a vast component spectrum, ensuring exceptional reliability even with odd-shaped components. In addition to its advanced placement capabilities, the SIPLACE SX provides a wide array of feeder and conveyor options, further enhancing its adaptability to various production requirements. Its efficient dual conveyor system facilitates the movement of smaller boards measuring up to 450mm by 260mm, while the optional Smart Transport Module enables processing of larger boards up to 1,525mm by 560mm. With its comprehensive features and capabilities, the SIPLACE SX redefines the standards of high-mix electronics production, empowering manufacturers to achieve unparalleled efficiency and quality in their assembly processes.
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