Introducing the YAMAHA Z:LEX YSM20WR Surface Mounter, taking the "1-head solution" to new heights with two types of heads that cater to a wide range of components while maintaining high speed without the need for head replacement. The YSM20WR offers unparalleled versatility with its high-speed general-purpose heads, perfect for handling ultra-small (0201mm) chip components. Additionally, its super wide-ranging type head provides exceptional load control and accommodates a broad spectrum of components, from ultra-tiny chips of 03015mm to ultra-large components measuring 55 x 100 mm and tall components up to 28 mm in height. Equipped with a new type wide-scan camera, the YSM20WR expands recognition capability to support high-speed mounting of components as small as 8 mm to 12 mm in size. Furthermore, the use of side lighting enables high-speed recognition of ball electrode components such as CSP (chip scale packages) and BGA (ball grid arrays). With its advanced features and capabilities, the YAMAHA Z:LEX YSM20WR sets a new standard in surface mount technology, empowering manufacturers to achieve unparalleled speed, accuracy, and reliability in their assembly processes.
The Ultra-High-Speed Modular Z:TA-R YSM40R sets a new standard in productivity, boasting a revolutionary speed of 200,000 CPH, making it the fastest in the world on a compact platform. This remarkable speed is achieved through cutting-edge technology, including innovative high-speed rotary heads and servo motors with advanced algorithms. Equipped with an innovative multi-camera system, the YSM40R ensures faster recognition speed and high accuracy. This system can also incorporate functions such as coplanarity check and side-view camera, further enhancing its capabilities. Additionally, the machine employs simultaneous component pickup technology and newly developed rotary control technology, along with lighter heads compared to previous high-speed models, to deliver revolutionary productivity. Despite its 4-beam unit configuration, the YSM40R boasts a remarkably small footprint, with a width of only 1 meter and a depth of 2.1 meters. This compact design maximizes productivity per line length and surface area, making it an invaluable asset for optimizing factory space utilization. Furthermore, the YSM40R features a dual lane system, offering superb versatility by feeding two parallel lanes of PCBs ranging from small to mid-sized, up to large-sized PCBs measuring 700mm in length. With its unparalleled speed, versatility, and compact design, the Ultra-High-Speed Modular Z:TA-R YSM40R redefines productivity standards, empowering manufacturers to achieve maximum efficiency and performance even within limited factory space.
The BTU Aurora 150N reflow oven boasts a range of cutting-edge features and advantages tailored to optimize soldering processes. These include modern conveyor options, a fully updated user interface, integrated AquaScrub flux management technology, innovative Smart Power energy savings software, and advanced process control technologies. Moreover, the exclusive closed-loop convection control technology and flexible zone configuration ensure optimal heating or cooling requirements for various production needs. The new Aurora reflow oven platform introduces industry-leading advancements, such as the first factory configurable heating and cooling architecture. This innovation allows users to customize the reflow oven according to specific product or process characteristics, whether it involves handling very heavy boards, accommodating slow cooling requirements, or enhancing throughput. AURORA’S ADVANCED CONVEYOR OPTIONS further enhance the functionality and efficiency of the BTU Aurora reflow oven. With up to 5 moveable rails, dual lane and speed capabilities, and a dual center support engagement system, this oven offers versatility and precision. Moreover, the chain return path within the rail minimizes power consumption, while the single platform design improves configurability and reduces the need for common parts. The wider board capabilities, including a 620 mm (24.4″) single lane and 305 mm (12″) per lane for dual lane configurations, coupled with a total product clearance of 80 mm, ensure seamless compatibility with diverse production requirements.
Introducing the BTU Pyramax 75A, a compact yet powerful soldering convection reflow oven designed to meet the demands of modern electronics manufacturing. With its 6 heated zones, this oven offers precise temperature control and uniform heating for efficient reflow soldering processes. BTU reflow ovens are renowned for their reliability and performance, making them a trusted choice for manufacturers worldwide. The Pyramax 75A is no exception, providing consistent results and peace of mind with every use. Despite its compact size, the Pyramax 75A is a high-end BTU air reflow solder oven, offering advanced features and capabilities to meet the needs of today's electronics industry. Whether you're soldering small batches or high-volume production runs, this oven delivers exceptional performance and quality.
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