Albania VT-S530
The OMRON VT-S530 PCB Inspection System materializes quantitative inspection of solder joints and component implementation, minimizing the risk of overlooking unknown defects by adhering to stringent quality product criteria based on industry standards. This contributes to the rapid initiation and stabilization of the inspection process.
The system conducts optimal inspections tailored to the specific items being inspected by combining advanced 3D and 2D technologies. This hybrid approach ensures comprehensive coverage and precision, enhancing the reliability of the inspection results.
Automation has significantly reduced the man hours required for the initial program creation, streamlining the setup process. The use of quantitative "quality criteria" based on 3D reconstruction has also substantially cut down the time needed for debugging, further improving efficiency.
Accurate detection of foreign objects is achieved by integrating 3D (height) and 2D (area) measurements across the entire PCB surface. This method ensures that areas without solder, such as lands, can be excluded from the inspection, preventing false positives and focusing on critical inspection zones.
High production throughput is supported through the system's dual lane capability. The dual lane operation is versatile, accommodating various PCBs with sizes up to 510 mm (W) x 330 mm (D), enhancing its handling capabilities and making it suitable for a wide range of production environments.
Category:
AlbaniaVT-S530
Product Description
| Model | OMRON VT-S530 |
| Hardware configuration | |
| Dimensions | 1180(W)×1640 (D)×1500(H) mm |
| Weight | Approx. 850kg |
| Power supply | |
| Voltage | 200 - 240VAC (single phase),voltage fluctuation range ±10% |
| Normal rated power | 2.0kVA |
| Line height | 900±20mm |
| Air supply pressure | 0.3 - 0.6MPa |
| Temperature range | 10 - 35°C |
| Humidity range | 35 - 80%RH (Non-condensing) |
| Image signal input block | |
| Imaging system | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology |
| Image resolution | 10μm/15μm |
| FOV | 10μ: 40×30mm; 15μ: 60×45mm |
| Functional specifications | |
| PCB size (min.) | 50(W)×50(D)mm |
| PCB size (max.) | Dual lane: 510(W)×330(D)mm; Single lane: 510(W)×680(D)mm |
| Clearance | Above: 50mm; Below: 50mm |
| Height measurement range | 25mm |
| Thickness | 0.4 - 4mm |
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