Burundi VSP3000

The MagicRay 3D SPI-VSP3000 series is ideal for 3D solder paste inspection following SMT screen printing. It offers fast programming without the need for a Gerber file, making setup quick and straightforward. The series features intelligent zero reference point technology to ensure accurate height measurements, effectively detecting issues such as solder bridging, solder breakage, and icicles. The MagicRay 3D SPI-VSP3000 series is also adept at handling PCBs with different color variations. Its bare board zero-point compensation enhances the accuracy of both solder paste height and volume measurements. The system includes SPC data analysis to help improve process quality, and its Three Point Checks software enables rapid detection of the root causes of excess solder paste, insufficient solder paste, and smearing. Overall, the MagicRay 3D SPI-VSP3000 series provides comprehensive inspection capabilities to ensure high-quality SMT production processes.

Category:

BurundiVSP3000

Product Description

ModelMagicRay VSP3000MagicRay VSP3000DMagicRayVSP3000XL
Image System
Camera Resolution10μm12μm15μm
FOV Size

60*45mm(15μm)

Inspection Speed

400-450ms/FOV

Camera

12M Pixel Camera

Illumination

3 Color Ring Shape LED(RGB)

Z Resolution

0.37μm

Height Accuracy

1μm

Gage R&R

<10%

Max. Inspection Size

20x20mm

Max. Inspection Height

600μm

Min. Distance Between PADs

100μm(150μm Paste Height)

PCB Handling
Max. PCB Size510x610mm510x320mm(DL) 
510x580mm(SL)
830x610mm
Min. PCB Size50x60mm50x80mm
Conveyor Height

900±20mm

Installation Specification
Machine Weight900Kg950Kg1300Kg
Machine Size935*1360*1570mm1295*1360*1570mm
Electric Supply

220VAC, 50/60HZ  Single Phase

Air Supply

0.4-0.6Mpa