Burundi 3Si Series

Saki’s high-speed, high-precision 3D-SPI machines are designed to excel in the inspection of SMT process solder printing. These machines meticulously inspect and analyze a wide range of potential issues, measuring solder paste area, height, and volume, as well as checking for bridging, solder horns, and BGA coplanarity compliance. The quality of the entire production line is maintained through machine-to-machine coordination with solder printing and pick-and-place machines. The design features an ultra-rigid gantry and biaxial drive with an ultra-high-definition linear scale, enabling high-speed movement of the optical head with remarkable stopping position accuracy. Thanks to its ultra-rigid gantry, biaxial drive, and ultra-high-definition linear scale, the 3D-SPI ensures high repeatability and contributes to the stability and quality of inspection result data. Stable inspection is further guaranteed by a strong, durable frame that provides reliability for 15 years and beyond, ensuring long-term consistency and performance.

Category:

Burundi3Si Series

Product Description

ModelSAKI3Si-MS2SAKI 3Si-LS2SAKI 3Si-ZS2
DimensionsM Single laneLSingle laneXL Single lane
Size(W)*(D)*(H)(mm)850 × 1430 × 15001040 × 1440 × 15001340 × 1440 × 1500
Weight850kg900kg900kg
Horizontal Resolution

7μm / 12μm / 18μm

Height measurement range

500μm

Electric Power

Single Phase - 200-240V+/-10%, 50/60Hz

Air Requirement

0.5MPa, 5L/min(ANR)

PCB Size(mm)50 x 60 – 330 x 33050 x 60 – 500 x 51050 x 60 – 686 x 870
PCB Clearance(Top)40mm40mm40mm
PCB Clearance(Bottom)60mm60mm60mm