Norway VT-S730
Built upon a history of innovation and a track record of delivering high-quality solutions, the VT-S730 3D AOI PCB Inspection System stands as the industry’s fastest Real 3D-AOI machine. It utilizes Omron’s unique 3D-Solder Joint Inspection (3D-SJI) technology to offer the best inspection capabilities available.
The VT-S730 series post-reflow inspection machines have been widely adopted in production lines where the highest level of quality control is essential, particularly in the automotive industry. These machines ensure that every solder joint meets stringent quality standards, thereby preventing defects and ensuring reliability in critical applications.
The VT-S730 series employs a combination of Phase Shift and Omron’s unique color image processing technology, known as "Color Highlight™ 3D Shape Reconstruction Technology." This sophisticated approach delivers unparalleled accuracy in solder joint inspection, referred to as 'SJI.' By reconstructing detailed 3D images of solder joints, the system can identify even the smallest imperfections, ensuring that only the highest quality products proceed through the production line.
The Omron VT-S730 not only enhances the precision of solder joint inspection but also contributes to overall production efficiency. Its rapid and accurate inspection capabilities reduce downtime and improve throughput, making it an invaluable asset for manufacturers who prioritize quality and efficiency in their production processes.
Category:
NorwayVT-S730
Product Description
| Model | OMRON VT-S730 | OMRON VT-S730-H |
| Hardware configuration | ||
| Dimensions | 1100(W)×1470 (D)×1500(H) mm | |
| Weight | Approx. 800kg | |
| Power supply | ||
| Voltage | 200 - 240VAC (single phase),voltage fluctuation range ±10% | |
| Normal rated power | 2.8kVA | 2.4kVA |
| Line height | 900±20mm | |
| Air supply pressure | 0.3 - 0.6MPa | |
| Temperature range | 10 - 35°C | |
| Humidity range | 35 - 80%RH (Non-condensing) | |
| Image signal input block | ||
| Imaging system | 4M pixel camera | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
| Image resolution | 15μm | |
| FOV | 30.00×30.72mm | 61.44×46.08mm |
| Functional specifications | ||
| PCB size (min.) | 50(W)×50(D)mm | |
| PCB size (max.) | 510(W)×460(D)mm | |
| Clearance | Above: 40mm; Below: 40mm | |
| Height measurement range | 25mm | |
| Thickness | 0.4 - 4mm | |
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