VT-S1080
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The OMRON VT-S1080 PCB Inspection System is the world’s most advanced 3D AOI system, designed for maximum system performance and high-quality productivity. It supports flexible manufacturing and reduces manpower needs through innovative AI programming. With a first pass yield efficiency of up to 99%, it ensures that the majority of inspected items pass without needing rework.
Featuring industry-first MDMC illumination, the VT-S1080 captures 3D images from all angles, allowing for accurate inspection of complex solder shapes. The 4-direction MPS projectors eliminate shadows and secondary reflections, enhancing inspection accuracy. It also assesses solder wetting direction in direct relation to IPC standards.
The VT-S1080 incorporates AI tools for skill-less, labor-saving tuning, maintaining high inspection standards. It complies with IPC-based 3D inspection standards and inspects hidden solder joints from advanced angles. Developed with Industry 4.0 in mind, it facilitates advanced machine-to-machine communication.
Continuous multi-lateral system monitoring and predictive maintenance ensure 100% utilization for production. A global library maintains consistent quality standards across all manufacturing sites. High reliability OCR and OCV provide reliable image detection. The unique single hardware platform across the S10 series simplifies maintenance and upgrades. Prepared for next-generation hardware, including advanced camera, GPU, and PC capabilities, the VT-S1080 enhances detectability and speed, setting a new standard in 3D AOI systems by optimizing inspection processes, improving productivity, and ensuring the highest quality standards in manufacturing.
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Description
| Model | OMRON VT-S1080-V2.0 |
| Hardware configuration | |
| Dimensions | 1180(W) x 1450(D) x 1500(H)mm (excluding tower lamp and monitor) |
| Weight | Approx. 1240kg |
| Power supply | |
| Voltage | 200 - 240VAC (single phase),voltage fluctuation range ±10% |
| Normal rated power | 2.0 kVA (Maximum current 10 A) |
| Line height | 900±20mm |
| Air supply pressure | Not required |
| Temperature range | 10 - 35°C |
| Humidity range | 35 - 80%RH (Non-condensing) |
| Image signal input block | |
| Imaging system | 5M pixel camera |
| Inspection principle | Hybrid 3DShape reconstruction MDMC*12 illumination +Phase shift (MPS *13) |
| Image resolution | 10μm |
| FOV | 25.9 x 19.4mm |
| Functional specifications | |
| PCB size (min.) | 50(W)×50(D)mm |
| PCB size (max.) | 510(W) x 680(D)mm(Single lane);510(W) x 330(D)mm(Dual lane) |
| Clearance | Above: 50mm; Below: 50mm |
| Height measurement range | 25.4mm |
| Thickness | 0.4 - 4mm |
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