SIPLACE X S
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Description
The new ASM SIPLACE X S placement machine is designed for high-volume production, establishing itself as an industry leader with its exceptional performance and reliability. Its rugged placement head and intelligent feeder ensure efficient and fast placement, while its unique digital vision system and intelligent sensors guarantee precise and consistent placement of every chip. Innovative PCB warpage detection technology effectively prevents placement issues caused by PCB deformation, significantly improving production yields.
Whether in demanding industries such as telecommunications/5G or IT/servers, the SIPLACE X S provides stable and uninterrupted process support, ensuring maximum productivity and quality. With its outstanding performance and cost-effectiveness, the SIPLACE X S helps you stand out in a highly competitive market and easily meet the most demanding production challenges.
| Technical Data | ASM SIPLACE X2 S | ASM SIPLACE X3 S | ASM SIPLACE X4 S |
| Placement speed (benchmark Rating) | 75,000 cph | 112,500 cph | 150,000 cph |
| Speed (IPC rating) | 65,000 cph | 97,050 cph | 130,000 cph |
| Feeder slots | 160 x 8 mm | ||
| Component spectrum | 0201 metric to 200 mm × 110 mm × 25 mm | ||
| Board size | 50 mm × 50 mm to 850 mm × 685 mm | ||
| Machine Size(L x W x H) | 1.9 m × 2.6 m × 1.6 m | ||
| Placement heads | Placement Head CP20, Placement Head CPP, Placement Head TWIN | ||
| Placement accuracy | 22 μm @ 3 σ (with Placement Head TWIN) | ||
| Conveyors | Single conveyor, flexible dual conveyor | ||
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