The MV-9 Series represents the pinnacle of full 3D AOI, offering unparalleled precision. It utilizes non-blind spot digital 12 projection moiré 3D inspection technology, ensuring comprehensive and accurate inspection. The system excels at inspecting diffused reflection components, OCR, and micro cracks with precision, thanks to its 8-phase coaxial color lighting. Equipped with a 25-megapixel 7.7um CXP main camera, the MV-9 Series can inspect the smallest components with remarkable detail. Additionally, it features a high-resolution 18-megapixel angled camera system, further enhancing its inspection capabilities. This combination of advanced imaging technologies ensures the highest yield through precise inspection. The MV-9 Series incorporates Side-Viewer® technology, enabling simultaneous five-dimensional inspection using 18-megapixel angled cameras. This system ensures no detail is overlooked. Intellisys®, the total process management system, enhances productivity and supports the implementation of smart factory principles. The AI Auto Programming feature simplifies programming by using an IPC international standard library, making it user-friendly and efficient. Designed to be applied to both SMT production lines and the second process of semiconductor manufacturing, the MV-9 Series is a powerful 3D AOI solution. By combining full 3D inspection, full 2D inspection, and deep learning algorithms, it delivers the best yield and precise inspection results, setting a new standard for quality and efficiency in the industry.

The OMRON VT-S530 PCB Inspection System materializes quantitative inspection of solder joints and component implementation, minimizing the risk of overlooking unknown defects by adhering to stringent quality product criteria based on industry standards. This contributes to the rapid initiation and stabilization of the inspection process. The system conducts optimal inspections tailored to the specific items being inspected by combining advanced 3D and 2D technologies. This hybrid approach ensures comprehensive coverage and precision, enhancing the reliability of the inspection results. Automation has significantly reduced the man hours required for the initial program creation, streamlining the setup process. The use of quantitative "quality criteria" based on 3D reconstruction has also substantially cut down the time needed for debugging, further improving efficiency. Accurate detection of foreign objects is achieved by integrating 3D (height) and 2D (area) measurements across the entire PCB surface. This method ensures that areas without solder, such as lands, can be excluded from the inspection, preventing false positives and focusing on critical inspection zones. High production throughput is supported through the system's dual lane capability. The dual lane operation is versatile, accommodating various PCBs with sizes up to 510 mm (W) x 330 mm (D), enhancing its handling capabilities and making it suitable for a wide range of production environments.

Built upon a history of innovation and a track record of delivering high-quality solutions, the VT-S730 3D AOI PCB Inspection System stands as the industry’s fastest Real 3D-AOI machine. It utilizes Omron’s unique 3D-Solder Joint Inspection (3D-SJI) technology to offer the best inspection capabilities available. The VT-S730 series post-reflow inspection machines have been widely adopted in production lines where the highest level of quality control is essential, particularly in the automotive industry. These machines ensure that every solder joint meets stringent quality standards, thereby preventing defects and ensuring reliability in critical applications. The VT-S730 series employs a combination of Phase Shift and Omron’s unique color image processing technology, known as "Color Highlight™ 3D Shape Reconstruction Technology." This sophisticated approach delivers unparalleled accuracy in solder joint inspection, referred to as 'SJI.' By reconstructing detailed 3D images of solder joints, the system can identify even the smallest imperfections, ensuring that only the highest quality products proceed through the production line. The Omron VT-S730 not only enhances the precision of solder joint inspection but also contributes to overall production efficiency. Its rapid and accurate inspection capabilities reduce downtime and improve throughput, making it an invaluable asset for manufacturers who prioritize quality and efficiency in their production processes.

The OMRON VT-S1080 PCB Inspection System is the world’s most advanced 3D AOI system, designed for maximum system performance and high-quality productivity. It supports flexible manufacturing and reduces manpower needs through innovative AI programming. With a first pass yield efficiency of up to 99%, it ensures that the majority of inspected items pass without needing rework. Featuring industry-first MDMC illumination, the VT-S1080 captures 3D images from all angles, allowing for accurate inspection of complex solder shapes. The 4-direction MPS projectors eliminate shadows and secondary reflections, enhancing inspection accuracy. It also assesses solder wetting direction in direct relation to IPC standards. The VT-S1080 incorporates AI tools for skill-less, labor-saving tuning, maintaining high inspection standards. It complies with IPC-based 3D inspection standards and inspects hidden solder joints from advanced angles. Developed with Industry 4.0 in mind, it facilitates advanced machine-to-machine communication. Continuous multi-lateral system monitoring and predictive maintenance ensure 100% utilization for production. A global library maintains consistent quality standards across all manufacturing sites. High reliability OCR and OCV provide reliable image detection. The unique single hardware platform across the S10 series simplifies maintenance and upgrades. Prepared for next-generation hardware, including advanced camera, GPU, and PC capabilities, the VT-S1080 enhances detectability and speed, setting a new standard in 3D AOI systems by optimizing inspection processes, improving productivity, and ensuring the highest quality standards in manufacturing.

The quality SAKI 3Di Series machines are among the best full 3D inspection systems on the market. They feature a closed-loop, dual servo-motor drive system, a high-resolution linear scale, and a rigid gantry structure, providing unsurpassed accuracy and repeatability for absolute measurements. The CoaXPress interface in the overhead camera captures images 1.7 times faster than previous models. The series offers three camera resolution levels—7μm, 12μm, and 18μm—to match specific application requirements. The software saves a full 3D image of the entire PCBA, enabling operators to create inspection data without using the physical board. Saki’s Self-Programming Function, developed on the principles of "Board less, Skill less, and Stress less," automatically creates accurate libraries for both SPI and AOI based on the database and BOM data associated with approximately 300,000 types of components. The SAKI 3Di Series offers camera resolutions of 7 μm, 12 μm, and 18 μm (versions M, L), and 18 μm (version XL), catering to a variety of inspection needs. It provides comprehensive inspection capabilities in the X, Y, and Z axes. The CoaXPress camera ensures a faster inspection and measurement process, enhancing overall efficiency. The Saki Self-Programming Software (SSP) simplifies the programming process, adhering to IPC 610 standards. It includes height and extra component detection (ECD) functions and the Fujiyama algorithm, which provides complete through-hole joint inspection in a single step. The system offers feedback from AOI to Pick-and-Place machines, ensuring a cohesive manufacturing process. Side cameras capture areas missed by overhead cameras, providing a more comprehensive inspection. The flexible gantry accommodates M, L, and XL PCBA sizes and supports dual lanes, making it adaptable to various production environments. The SAKI 3Di Series is ready for Industry 4.0 integration, and its common platform supports both 3D-SPI and 3D-AOI, ensuring versatility and future-proofing for advanced manufacturing needs.

TRI's top-of-the-line 3D AOI solution provides the fastest multi-angle PCB inspection, utilizing blue-laser-based true 3D profile measurement for comprehensive defect coverage. By integrating cutting-edge software and a third-generation intelligent hardware platform, the TR7500 SIII 3D delivers robust 3D solder and component defect inspection with extensive coverage and easy programming. This system features high-speed color multi-angle inspection for components as small as 01005, ensuring thorough defect detection with its hybrid 2D+3D inspection technology. It offers true 3D profile measurement using dual laser units, enhancing inspection accuracy. The TR7500 SIII 3D also boasts a rapid programming interface, complete with an auto library and offline editing capabilities, streamlining the programming process.