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The KOH YOUNG Zenith AOI Series is the only machine that offers True 3D Inspection, effectively addressing issues caused by highly specular packages and shadows from adjacent parts. Utilizing patented True 3D technology, the Zenith measures true profilometric component shapes, including foreign materials, patterns, and solder joints, to overcome inspection challenges. Uniquely, the Zenith AOI Series sets its inspection criteria based on IPC-610 standards for electronic assembly acceptability. It provides clear and precise AOI measurements to accurately identify a variety of defects, such as missing solder, offset, polarity issues, upside-down components, OCV/OCR, solder fillet problems, billboarding, lifted leads, lifted bodies, tombstones, bridging, and more. With its quantitative True 3D measurement-based approach, the system ensures exceptional accuracy and repeatability. Leveraging Koh Young’s proprietary vision algorithms, the Zenith Series can quantify the exact height of a solder joint. Even in the presence of shadows or interreflection challenges, the Zenith performs accurate inspections and measurements according to IPC-610 standards for electronic assembly acceptability.
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